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ACCEPT AND PROCEED

Product

Sputtering target bonding

Sputtering target bonding

Bonding examination equipment: large C-Scan

 
 
 
 
 
 
 
 
 
 

Unique metallization wetting process for material bonding which is an optimized method for large size sputtering target. We have uniform heating plate, flatness equipment, ultrasonic tester and transportation equipment to meet vary TFT-LCD generations.

Services

  • Target bonding for metal, oxide-based and brittle materials.

Contact Detail
Address:No.1, Luke 8th Rd., Lujhu District, Kaohsiung, Taiwan R.O.C.
TEL:+886-7-6955125
FAX:+886-7-6955205
Email:service@e-ttmc.com.tw
URL:http://www.e-ttmc.com.tw
ZIP:82151