Product
Sputtering target bonding
Bonding examination equipment: large C-Scan
Unique metallization wetting process for material bonding which is an optimized method for large size sputtering target. We have uniform heating plate, flatness equipment, ultrasonic tester and transportation equipment to meet vary TFT-LCD generations.
Services
- Target bonding for metal, oxide-based and brittle materials.
Contact Detail
| Address: | No.1, Luke 8th Rd., Lujhu District, Kaohsiung, Taiwan R.O.C. |
| TEL: | +886-7-6955125 |
| FAX: | +886-7-6955205 |
| Email: | service@e-ttmc.com.tw |
| URL: | http://www.e-ttmc.com.tw |
| ZIP: | 82151 |
